The thin-film magnetic head of the present invention is a CPP type head and comprises an anti-ferromagnetic layer, a pinned layer, a free layer, and a nonmagnetic layer disposed between the pinned layer and the free layer. The pinned layer is provided with a multilayer part comprising a first layer formed from Cu; a second layer formed from Cu and disposed closer to the free layer than is the first layer; and an intermediate layer. The intermediate layer is disposed between the first and second layers while in contact therewith, and is formed with a partly oxidized ferromagnetic layer.