A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.