A honeycomb extrusion die includes an inlet face having a plurality of feed channels, and a discharge face having an array of intersecting honeycomb discharge slots. The extrusion die also includes a bonded array of pin elements each exposed on the discharge face of the die and juxtaposed to form the discharge slots of the discharge face and the array of feed channels, wherein the discharge slots extend from the feed channels, and wherein the feed channels communicate with the discharge slots so as to guide an extrudable material toward the discharge face. Each pin element includes a plurality of discharge slot surfaces, a plurality of feed channel surfaces continuous with the discharge slot surfaces for guiding the extrudable material toward the discharge face, and a plurality of spacing surfaces for spacing each pin element from adjacent pin elements.