A plurality of buried conductors and/or buried plate patterns formed
within a monocrystalline substrate is disclosed. A plurality of
empty-spaced buried patterns are formed by drilling holes in the
monocrystalline substrate and annealing the monocrystalline substrate to
form empty-spaced patterns of various geometries. The empty-spaced
patterns are then connected through vias with surfaces of the
monocrystalline substrate. The empty-spaced patterns and their respective
vias are subsequently filled with conductive materials.