In an IC mounting region 70 of a substrate 20 constituting a liquid crystal device, first terminals 91A, 91B, and 91C are divided into a plurality of terminals 911A, 912A, 913A, 914A, 921B, 922B, 921C, and 922C by slits 96 formed of portions where an ITO film forming wiring patterns 91 and the first terminals 91 is not formed. For this reason, when the first terminals 91 and first electrodes 71 are electrically and mechanically connected by an anisotropic conductive film, a resin component contained in the anisotropic conductive film fixedly bonds a driving IC 7 to the second transparent substrate 20 while it enters the slits 96. Since the area of the resin component 61 of the anisotropic conductive film in contact with the first terminals 91 is large, fixing strength of the IC 7 is increased.