A semiconductor processing device includes a processing section to process a semiconductor substrate in accordance with job information which is used to process the semiconductor substrate. An imaging section takes an image of a processed portion of the semiconductor substrate for each time of processing by the processing section. An image-processing section converts any one and another of the images to image data which are different from each other in data volume, and associates a result of processing from the processing section, the job information and the image data with each other in each processing. An input/output section outputs at least the result of processing and the image data.