A semiconductor device having a structure miniaturizable through simple
fabrication steps and a method of fabricating a semiconductor device
capable of remarkably improving production efficiency are obtained. The
semiconductor device comprises a semiconductor chip including a
semiconductor circuit having a prescribed function and an electrode on
one main surface, a wire having a first end connected with the electrode
and a second end having a connecting terminal connected to an external
device and an insulator sealing at least the main surface of the
semiconductor chip. The connecting terminal provided on the second end of
the wire is a part formed while keeping a state integrated with the
remaining part of the wire, and exposed on a bottom surface opposite to
the upper surface of the insulator closer to the main surface.