A transcutaneous device dressing and method for its use with a transcutaneous medical device, such as an intravascular catheter, which punctures the skin of a patient and which has a portion of the medical device protruding from the skin which can lead to infection. The dressing includes a top and a bottom dressing, both being formed from a flexible material and having upper and lower surfaces, with the lower surface being the skin facing surface in use. The bottom dressing has a slit formed therein extending from one edge inwardly to a termination point within the confines of the bottom dressing. An anti-microbial material is provided without the use of adhesives at the upper and lower surfaces of the bottom dressing, and at least at the lower surface of the top dressing. In use, the bottom dressing is placed next to the skin, the slit allowing the bottom dressing to surround the puncture site such that the lower surface of the bottom dressing is in contact with the skin while the upper surface of the bottom dressing is in contact with a portion of the medical device protruding from the skin. The top dressing is placed above the puncture site such that its lower surface is in contact with a portion of the medical device protruding from the skin. In this way, there is exposure of the portion of the medical device protruding from the skin to the anti-microbial activity of the anti-microbial material.