An electronic apparatus includes a heat-generating device mounted on a surface of a printed circuit board and is surrounded with wall members of a housing. The wall members are connected to a ground electrode on the other surface of the printed circuit board, the ground electrode being disposed over substantially the entire surface under the heat-generating device. Lugs provided in covers are in contact with the respective ends of the wall members. The direction in which each lug is raised (direction from the base to the tip) coincides with the direction from the heat-generating device to a temperature-increase restricted region.