A chip scale marker including a laser system, a wafer holder supporting a
wafer to be processed, and a camera moving above the wafer holder by
being connected to an X-Y stage and monitoring the wafer supported on a
center hole of the wafer holder, the chip scale marker includes a unit
detachably arranged on a laser beam path from the laser system and
reducing power density of a laser beam, and a screen arranged on a center
hole of the wafer holder and indicating a position where a laser beam
from the laser system is irradiated.