A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Preferably, the stretched heat-dissipating metal plate has a thickness smaller than that of the heat-dissipating metal plate before stretching by not more than 20%. The chip has good compression strength in the radial direction and the heat-dissipating metal plate has higher tensile strength after being stretched and taking shape, providing a more stable structure and avoiding damage to the chip due to radially outward tension. The combined chip/heat-dissipating metal plate thus obtained is more stable and thus benefits the subsequent cutting by a laser cutting apparatus.