A semiconductor device is arranged so as to include (i) a wire L1, connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB1 connected not directly to but to one of a pair of electrodes of a capacitor provided between the wire LB1 and a voltage VGH wire, each of the wire L1 and the wire LB1 including a voltage input terminal. This arrangement provides (i) a semiconductor device, including a built-in capacitor, which makes it possible to shorten time required in an electrical screening test (final test) so as to reduce cost, and (ii) an electrical inspection method of the semiconductor device.