Printed circuit board with insulated metal substrate with integrated cooling systemlt comprises a metal substrate (10), at least one electrically insulating layer (11) adhered to said metal substrate (10) and several electro-conducting tracks (12) capable of interconnecting electronic power components (24), adhered to said electrically insulating layer (11), said metal substrate (10) incorporating several heat transporting channels comprising several conduits for a heat-carrying fluid, conduits which extend to the outside of the metal substrate up to a heat transfer area to an outside medium.