A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.

 
Web www.patentalert.com

< Double-sided pressure-sensitive adhesive sheet and method for sticking and fixing touch panel to display device

< Imageable element containing silicate-coated polymer particle

> Protease variants and compositions

> Adhesive support method for wafer coating, thinning and backside processing

~ 00291