The present invention provides a metal slurry for electrode formation which slurry is high in dispersion property and enables formation of high density electrode films. The metal slurry for electrode formation is composed of a spherical metal powder of 0.1 to 2.0 .mu.m in mean particle size and a dispersion medium. By making the spherical metal powder have a mean particle size falling within the range from 0.1 to 2.0 .mu.m, there can be obtained a metal slurry for electrode formation which slurry can be coated through a nozzle and is high in dispersion property, without using expensive nanoparticles. In addition, as the dispersion medium, water or lower molecular weight alcohols can be used. Furthermore, the dispersion property can be improved by further adding a dispersant of 10 wt % or below (exclusive of zero) in relation to the metal powder.