Disclosed herein is a photoresist composition which includes a norbomene
copolymer having an epoxy group, an acid generator, and an organic
solvent. The norbomene polymer shows superior mechanical and thermal
properties, high transparency, excellent insulating properties, and
particularly, improved mechanical properties due to the presence of an
epoxy group. The photosensitive resin composition shows superior
performance, e.g., transparence, developing properties, residual film
characteristics, chemical resistance, heat resistance, and flatness.
Particularly, since the photosensitive resin composition enables easy
formation of a pattern as an interlayer insulating film and shows a high
light transmittance even when being formed into a thin film with a
relatively large thickness, it is suitable for the production of an
interlayer insulating film used in the fabrication processes of LCDs.