A package module of an IC device comprises a substrate, at least one
semiconductor device, and an interconnected layer. The substrate has a
first surface and a second surface, wherein the substrate further
contains a plurality of metal plugs, which penetrate the substrate and
connect the first surface and the second surface. The semiconductor
device is located on the first surface of the substrate, wherein the
semiconductor device contains a plurality of metal pads, each of which is
connected to one of the metal plugs. The interconnected layer is formed
on the second surface of the substrate, wherein the interconnected layer
is comprised of a plurality of metal circuits, a plurality of land pads,
and a plurality of via pads, wherein each of the metal plugs is connected
to one of the metal circuits.