In the electroconductive contact unit of the present invention, a gold plated layer 8 is formed over the surface of an electroconductive needle member 2 via a Ni under layer 7a, and a layer of iridium (titanium nitride, rhodium or hafnium nitride) is formed on the gold plated layer 8 of the needle portion 2a by sputtering, via an Ni under layer 7b. Thereby, the tip portion is provided with an improved resistance to oxidization and wear without using any special material for the needle member, and the durability of the needle member is improved so that the running cost can be minimized.

 
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