Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about -40.degree. C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.