A photoresist composition is provided. The photosensitive composition includes a photosensitive resin present in an amount of about 4% by weight to about 10% by weight, a photo-acid generator (PAG) present in an amount of about 0.1% by weight to about 0.5% by weight and a residual amount of a solvent. The photosensitive resin comprises a first resin which includes a first blocking group and a second resin which includes a second blocking group having an activation energy less than the first blocking group.