A method can be provided of forming a photoresist pattern on a substrate. The method employs a photoresist composition comprising a photosensitive polymer, the photosensitive polymer has a molecular weight in a range of from about 1,000 up to about 100,000 and comprises repeating units having a structural formula: wherein R represents an acid-labile hydrocarbon group having from 1 up to 20 carbon atoms.

 
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< Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition

> Photoresist composition and method of forming a photoresist pattern using the same

> Photoresist compositions comprising resin blends

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