According to the present invention, there is provided a semiconductor substrate cleaning apparatus comprising: a support which supports a semiconductor substrate; a rotating mechanism which rotates the semiconductor substrate; a first supply unit which supplies a first treatment liquid to which an ultrasonic wave is added, to a surface, on which no circuit pattern is formed, of the semiconductor substrate; and a second supply unit which supplies a second treatment liquid to an edge of a surface, on which a circuit pattern is formed, of the semiconductor substrate.