A method and apparatus electrically coupling input/output bond pads that are disposed proximate to one another on a microelectronic device. The apparatus includes a microelectronic device having at least two conductive input/output bond pads electrically coupled to an integrated circuit of the microelectronic device and first and second conductive stud balls bonded to first and second input/output pads, respectively, and a third conductive stud ball bonded to the first and second conductive stud balls. A wire bonding tool in "stud ball" mode is utilized to bond the conductive stud balls.

 
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< Dual ramp rate dielectric breakdown testing methodology

< Method and system for bonding a semiconductor chip onto a carrier using micro-pins

> Bond pad structure comprising multiple bond pads with metal overlap

> Semiconductor laser element having end-facet protection layer which includes unoxidized or unnitrided first sublayer formed on end facet and second sublayer produced by oxidizing or nitriding the surface of the first sublayer
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