A method of manufacturing a semiconductor device having a connection terminal and a substrate on which a circuit section and an electrode are stacked in this order, the circuit section having a multilayer interconnect structure, the electrode being conductively connected to the circuit section, and the connection terminal penetrating the substrate and being conductively connected to the electrode. Part of the connection terminal is formed simultaneously with an interconnect in an interconnect layer of the circuit section.

 
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< Capacitor and method of producing same

< Arrangement of vias in a substrate to support a ball grid array

> Components, methods and assemblies for multi-chip packages

> Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
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