A kit for making a relief image that includes a film made of an infrared-imageable material and a separate imageable article comprising a photosensitive material disposed on a substrate. The film may be used to form a mask image that is opaque to a curing radiation by exposing the infrared-imageable material to infrared radiation. The mask image may then be transferred to the photosensitive material. The resulting assembly may be exposed to the curing radiation resulting in exposed and unexposed areas of the photosensitive material. Finally, the photosensitive material and mask image may be developed with a suitable developer to form a relief image.