A mid-plane is disclosed. The mid-plane includes a first printed circuit board having a plurality of plated vias adapted to receive tails attached to a first connector and having a plurality of unplated clearance holes adapted to receive tails attached to a second connector. The second printed circuit board has a plurality of plated vias adapted to receive tails attached to the second connector and has a plurality of unplated clearance adapted to receive tails attached to the first connector.

 
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