A method is provided to improve the adhesion between bonding pads and ball portions of gold wires to improve the reliability of a semiconductor device. About 1 wt. % of Pd is contained in gold wires for connection between electrode pads formed on a wiring substrate and electrode pads (exposed areas of a top layer wiring formed mainly of Al) formed on a semiconductor chip. In bonded portions between the electrode and ball portions of the gold wires, an interdiffusion of Au and Al is suppressed to prevent the formation of Au4Al after PCT (Pressure Cooker Test). Thus, a desired bonding strength is obtained even when the pitch of the electrode pads is smaller than 65 m and the diameter of the ball portion is smaller than 55 m or the diameter of the wire portion of each gold wire is not larger than 25 m.

 
Web www.patentalert.com

< Antibiotics-independent vector for constant high-expression and method for gene expression using the same

< Liquid discharge head and method for manufacturing such head

> Rimless eyeglasses and parts thereof

> Cameras having film unit dependent demonstration mode image deletion and methods

~ 00265