A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.

 
Web www.patentalert.com

< Integrated power supply and air inlet unit

< Captive socket actuator

> Heat sink structure with embedded electronic components for semiconductor package

> Automotive control module housing

~ 00264