A spackling compound is provided that is easy to apply smoothly, can be applied in thicker layers than known spackling without cracking upon drying, and can be modified after drying without pitting, flaking, or crumbling, particularly at the edges of the applied spackling patch. The composition includes polyaramid fibers that act as structural strengtheners to provide the dried composition with exceptional strength and resistance to cracking. In a second embodiment, the composition further includes low aspect ratio (about equal to 1) ceramic microparticles that fill voids in the mixture to produce a smoother, more dense composition. Upon drying, the ceramic microparticles produce a very smooth surface that can be sanded without flaking or crumbling. Additionally, the invention provides methods of preparing and using the compositions to produce smooth repair patches with no cracks, are easy to sand without pitting or flaking, and to provide improved structural integrity to the repaired area.