A solid-state imaging device and a frame are secured onto a base plate. The frame has a positioning portion in contact with a side face of a substrate, so as to protect the bonding wire positioned thereunder while positioning and supporting the substrate abutting thereagainst. The frame is made of a metal, and is further provided with a shield member, so as to restrain X-rays from entering a bonding wire and the like. The substrate is set relatively thin, whereby its X-ray transmissivity improves, though substrate bent occurs in this case. Since an elastic body presses the substrate, the bent of the substrate is corrected.

 
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> Inspection of common materials for radiation exposure by Atomic and/or Magnetic Force Microscopy

> Image read-out method and system, solid image sensor, and image detecting sheet

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