The present invention provides a semiconductor device 200 having a localized halo implant 250 located therein, a method of manufacture therefore and an integrated circuit including the semiconductor device. In one embodiment, the semiconductor device 200 includes a gate 244 located over a substrate 210, the substrate 210 having a source and a drain 230 located therein. In the same embodiment, located adjacent each of the source and drain 230 are localized halo implants 250, each of the localized halo implants 250 having a vertical implant region 260 and an angled implant region 265. Further, at an intersection of the vertical implant region 260 and the angled implant region 265 is an area of peak concentration.

 
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