A substrate compiling system includes an actuator, cable and tamper device. The tamper device includes a clamp assembly. The clamp assembly is retracted and extended. The clamp assembly can be used to clamp an edge of each compiled set of substrates and transfer the compiled set to a stacking tray, platform or the like. The clamp assembly may remain in an extended position until all other substrate supporting structures no longer support the substrates and an opposing unclamped edge of the compiled set engages the stacking tray below.

 
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