A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface: and hardening the structure in the first flowable medium to form the patterned film.

 
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