A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally beyond the metal particle towards the chip, and the chip and the metal particle are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.

 
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< Pro9836 polypeptides

> Steady-state non-equilibrium distribution of free carriers and photon energy up-conversion using same

> Material for chromatography

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