A circuit that eliminates an off-chip inductive component connected between an
integrated circuit (IC) arranged on a package and an external load comprises a
package and an IC that is arranged on the package. A first bondwire arranged on
the package has one end that communicates with the external load and an opposite
end that communicates with the IC. A second bondwire located on the package has
one end that communicates with the external load and an opposite end that communicates
with the IC.