An IC body is loaded on a case made of a thermoplastic resin material and sealed
to the case with a sealing portion made of thermoplastic resin material, whereby
an IC card is manufactured. The IC body includes a wiring substrate formed with
an external connection terminal at a back surface thereof, a semiconductor chip
loaded over a surface of the wiring substrate and electrically connected to the
external connection terminal via an interconnect, and a sealing portion made of
thermoplastic resin material so as to cover the semiconductor chip and a bonding
wire. The sealing portion is formed so that the external connection terminal is
exposed. Thus, making it possible to increase the strength of IC cards and, at
the same time, to reduce the manufacturing cost and improve the reliability.