A thin-film RC circuit element suitable for a transmission line termination circuit
is prepared by a process wherein
- 1) a first metal layer of an anodizable metal is deposited on a substrate;
- 2) the exposed surface of the anodizable metal layer is anodized to
produce an oxide layer,
- 3) a second metal layer of electrically conductive metal is provided
on the oxide layer, and
- 4) the first metal layer is etched to form an electrically resistive
conductive path electrically connected to the region f the first metal layer beneath
the second metal layer. A thin-film RC circuit element is also provided having
a first layer of an anodizable metal formed on an electrically insulating substrate
so as to provide two capacitor plates connected by a resistive strip, an oxide
layer formed on the capacitor plates, and upper capacitor plates positioned on
the oxide layer in register with the lower capacitor plates.
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