A bond pad is elevated from a slider body by a conductive post. The bond pad
is
disposed atop the post, which typically possesses a cross-sectional area smaller
than the surface are of the bond pad. Thus, rather than having the entire surface
of the bond pad in contact with the slider body, only the cross-sectional area
of the conductive post is in contact therewith. Alternatively, a bond pad may be
split into two electrically coupled pads: one pad used for housing a permanent
bond, and a second pad used for housing a temporary bond. The pad used to house
the temporary wire bond may be disposed atop a sacrificial layer. After a lapping
process, the sacrificial layer may be etched away, thereby permitting the temporary
pad to be removed.