Apparatus and method for treating medical implants are provided. The apparatus may include a vessel having a treatment chamber with an inside surface, an outside surface, an entrance, a plurality of fluid passages passing from the outside surface to the inside surface, and a compressible fluid supply line coupled to at least one of the fluid passages. In this embodiment, passages may be positioned and sized to create a buffer zone of compressible fluids between the inside surface of the treatment chamber and a medical implant placed therein. The method may include placing a first medical implant into a treatment chamber having inside surfaces, retarding the first medical implant from contacting the inside surfaces of the treatment chamber by injecting compressible fluid into the treatment chamber, injecting a therapeutic into the treatment chamber, and removing the first medical implant.