A heat dissipating device (1) for removing heat from electronic devices
is disclosed. The heat dissipating device includes a heat sink (30) and
at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive
body and a plurality of fins (35) extending from the body. The body includes
a solid block (32) and two extension arms (34) extending aslant from
a top of the block in opposite directions. An U-shaped groove (35) is defined
in the block and extends to an upper portion (33) of the block. The heat
pipe comprises an evaporating portion (22) and a condensing portion (24)
extending upwardly from the evaporating portion. The heat pipe is received in the
groove so that the heat pipe absorbs heat via the evaporating portion and transfers
the heat to the upper portion of the block via the condensing portion thereof.