There is provided a cellular phone housing formed with a base made of a resin material by molding, wherein the base is coated with a metal multilayer including a lower metal layer formed on a surface of the base with metal plating and an upper metal layer formed on the lower metal layer with metal plating, and wherein the lower metal layer is made of a first metal which is ductile and the upper metal layer is made of a second metal which is brittle compared with that of the first metal.