It is an object of the present invention to provide a retention module, a heat sink and electronic apparatus for effectively the heat from a chip set. The retention module for a CPU is provided with a heat sink for the chip set.

 
Web www.patentalert.com

< Parallel cooling of heat source mounted on a heat sink by means of liquid coolant

< Clamping structure and heat dissipating module using same

> Thermal interface apparatus, systems, and fabrication methods

> Heat sink
~ 00235