This invention relates to a machinable or grindable resin-forming material, comprising (A) a machinable or grindable resin or a precursor thereof, and (B) microcapsules comprising an encapsulated material (a) in liquid state and a wall material (b); wherein the machinable or grindable resin-forming material includes (B) at a ratio of 0.5 to 90 mass parts with respect to 100 mass parts of (A), and to a resin molded product for material of a model, which is formed by melting and solidifying or hardening and shaping the machinable or grindable resin-forming material. Accordingly, a machinable or grindable resin-forming material and a resin molded product for material of a model, in which the amount of scattering dust at the time of cutting or grinding the resin molded product is reduced, and a decrease in the strength is small, can be provided.

 
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< Fired spinel complex oxide and method for preparing the same

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> Coating liquid for producing insulating film having low dielectric constant

> Process for the preparation of active somatotropin from inclusion bodies

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