Apparatus and method for post-cure application of electronics to a tire includes the steps: forming an antenna wire into a predetermined shape having first and second free ends; creating a transponder splice region between the first and second free antenna ends, incorporating transponder splice region identification indicia; curing the antenna wire into a tire during a tire manufacturing procedure; locating the transponder splice region by means of the transponder splice region identification indicia; and splicing the antenna wire ends to a sensor in a post-cure procedure. The transponder splice region identification indicia may include sandwiching a junction box or the overlapped ends of the antenna wire or wires between layers of select material that will not bond to the tire inner liner or antenna cover compounds and incorporating an air pocket in the sandwiched region. Alternatively, or in conjunction with the air pocket, a unique cover layer differentiated by color or other discernible means may be utilized to seal and cover the transponder splice region.