The present invention provides for low cost discrete inductor devices in an all organic platform. The inductor devices can utilize virtually any organic material that provides the desired properties, such as liquid crystalline polymer (LCP) or polyphenyl ether (PPE), in a multilayer structure, wherein the organic materials have low moisture uptake and good temperature stability. Each layer may be metalized and selectively interconnected by vias formed in respective layers so as to form winding or coiled inductors. The inductor devices may advantageously include external shielding formed by metalizing the side walls and top surface of the inductor devices on in-built shielding achieved by the utilization of the hybrid co-planar waveguide topologies. The inductor devices can be configured for either ball grid array (BGA)/chip scale package (CSP) or surface mount device (SMD) mounting to circuit boards.