An integrated circuit substrate having embdedded passive components provides a
reduced cost and compact package for a die and one or more passive components.
An insulating layer of the substrate is embossed or laser-ablated to generate apertures
for insertion of a paste forming the body of the passive component. A resistive
paste is used to form resistors and a dielectric paste is used for forming capacitors.
A capacitor plate may be deposited at a bottom of the aperture by using a doped
substrate material and activating only the bottom wall of the aperture, enabling
plating of the bottom wall without depositing conductive material on the side walls
of the aperture. Vias may be formed to the bottom plate by using a disjoint structure
and conductive paste technology. Connection to the passive components may be made
by conductive paste-filled channels forming conductive patterns on the substrate.