A semiconductor apparatus includes lower conductive film strips, an inter-layer insulating layer, implanted conductive members, and upper conductive film strips. The lower conductive film strips are formed in a pattern closely adjacent in a line width orientation, electrically separated from each other. The inter-layer insulating layer is formed the lower conductive film strips. The implanted conductive members are implanted in connection holes formed in the inter-layer insulating layer at positions corresponding to both edge sides of the lower conductive film strips. The upper conductive film strips are formed on the implanted conductive members and the inter-layer insulating layer to connect the lower conductive film strips in series so that the lower conductive film strips, the implanted conductive members, and the upper conductive film strips form an electric coil.