A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes as one or more masks; a step for fabricating the plurality of probes using the mask; and disposing the plurality of probes through corresponding holes in a first die and a second die. The step for fabricating the plurality of probes may include one of photo-etching and photo-defined electroforming.

 
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< Substrate for carrying a semiconductor chip and semiconductor device using same

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> Photonic crystal, method of producing photonic crystal, and functional element

> Information recording medium having pair of electrodes
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