A multi-chip package for a computer disc drive. In a preferred embodiment, the multi-chip package (MCP) includes a first die having a buffer function thereon, such as an SDRAM device, and a second die including a channel function and a controller function thereon. The two die are packaged in a single package for placement on a printed circuit board of the disc drive.

 
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< Electronic component having stacked semiconductor chips in parallel, and a method for producing the component

< Semiconductor device adapted to remove noise from a signal

> Stacked packages

> Methods and apparatus for improving high frequency input/output performance

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