In one aspect, the present invention is a system and method for obtaining information regarding one or more contact holes and/or vias on a semiconductor wafer. In this regard, in one embodiment, the system comprises an electron gun to irradiate an electron beam, having a variable acceleration voltage, on the one or more contact holes and/or vias. The system further includes a current measuring device, coupled to the semiconductor wafer, may measure a compensation current, wherein the compensation current is generated in response to the electron beam irradiated at a plurality of acceleration voltages on the one or more contact holes. The system also includes a data processor, coupled to the current measuring device, to determine information relating to the one or more contact holes and/or vias using the compensation current measured for the plurality of acceleration voltages of the electron beam.

 
Web www.patentalert.com

< Image forming apparatus employing work function relationships

< Developing method for an image forming apparatus and developing device using the same

> Process for circumferential magnetization of magnetoelastic shafts

> Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module

~ 00226